Technology
HBM3
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM), initially developed by Samsung, AMD and SK Hynix. It is often used in conjun
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High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM), initially developed by Samsung, AMD and SK Hynix. It is often used in conjunction with performance-oriented graphics accelerators, network devices, FPGAs and ASICs; some CPUs utilize HBM as on-package cache or RAM, such as the NEC SX-Aurora TSUBASA and Fujitsu A64FX. The first HBM memory chip was produced by SK Hynix in 2013, and the first devices shipped with HBM were the
